TOAGOSEI develops advanced materials for electronics, mobility, manufacturing, construction, healthcare, and everyday products. Explore our research reports and product technologies.
OXT-211 (POX) and OXT-213 (CHOX) are colorless, transparent, low-viscosity monofunctional oxetanes for cationic UV curing and thermal cationic curing. In a UV-curable epoxy system, they can serve as cationic curable resin components, cationic curable additives, epoxy resin additives, reactive diluents for epoxy, low-viscosity epoxy additives, UV coating additives, or UV adhesive additives. Their viscosities are 13.8 and 6.7 mPa·s at 25°C, and both are compatible with cationically curable epoxy resin and common organic solvents.
ARONIX UVX-5800 is a high-purity, specialty-acrylate UV-curable insulating coating developed to improve electrical insulation and insulation reliability in high-density electronics. It can be considered for UV-curable conformal coating, PCB protective coating, circuit board insulating coating, FPC protective coating, FPD or display insulating coating, and transparent insulating coating applications for silver electrodes, polyimide film, glass, and ACF interfaces.
Formulation components for paint compositions, inkjet inks for 3D printing, and various photocurable coating materials and adhesives.
ARONIX MT-3547, MT-3548 and MT-3549 are multifunctional acrylates made by transesterification for UV-curable resin and thermosetting resin formulations. They expand formulation design space for paints, UV inks, adhesives and pattern formers through low viscosity, high hardness, hydrophilicity, high hydroxyl value and high purity.
(Application to areas not exposed to UV light, such as underneath components)
There are shadow-curable UV adhesives designed for assemblies in which UV light cannot reach parts of the bond line. Conventional UV-curable adhesives can remain uncured under components, in gaps, beneath opaque parts or a black mask, and between overlapped parts, creating incomplete cure, bond failure or insulation failure. This UV adhesive for shadow areas uses radical photopolymerization of specialty acrylates so that, after short UV irradiation, curing progresses from the exposed zone into hidden and hard-to-cure areas.
The combination of cohesive and flexible resin properties, high insulation resistance, dielectric strength, chemical resistance, damp-heat durability, and card-lamination workability supports use as a contactless IC card adhesive, smart card adhesive, copper/aluminum bonding film, and IC-chip module adhesive.
ARON MELT PES is a saturated copolyester hot melt adhesive for IC cards, developed as an IC card adhesive film and laminate adhesive for contactless cards and smart cards. In a typical contactless IC card, the adhesive film bonds a PET, PETG, PVC, or polycarbonate surface layer to a circuit board layer carrying an antenna coil and IC chip. Its gap-filling ability follows uneven IC-chip and circuit surfaces while maintaining card durability. The series provides plastic and metal bonding, including adhesion to PET, PVC, PC, aluminum, copper, and iron, making it suitable for plastic-to-metal constructions and IC-chip module fixing.
UV curable resin, photocurable resin, crosslinkable resin, hard coating material, optical coating material, or functional coating components. Their nanohybrid structure combines hardness, transparency, heat resistance, and resin compatibility.
The UV-curable SQ Series is an organic-inorganic hybrid material combining photopolymerizable groups with a silsesquioxane backbone. Cationic OX-SQ and radical AC-SQ grades can serve as UV curable resin, photocurable resin, crosslinkable resin, hard coating material, optical coating material, or functional coating components. Their nanohybrid structure combines hardness, transparency, heat resistance, and resin compatibility.
The chemicals are liquid acrylic polymers produced by Uniform Functional Oligomer (UFO) technology, a high-temperature, continuous bulk polymerization process using almost no polymerization solvent, initiator or chain-transfer agent. This creates a solvent-free acrylic polymer platform with low impurity, low odor and high solids for weather-resistant sealant resin design. It supports solventless sealants targeting a low VOC sealant resin, high durability and exterior performance.
The materials support use as a durable sealant plasticizer, building sealant additive, long-life sealant additive, and sealant formulation plasticizer for exterior sealants requiring weather resistance, waterproofing, airtightness, low modulus, flexibility, and resistance to bleeding and staining. The US Series therefore expands sealant formulation design from low-modulus flexibility to higher-modulus adhesive-type performance.
ARUFON US Series is an alkoxysilyl-functional reactive plasticizer for sealants, developed as a liquid acrylic oligomer and plasticizer for modified silicone sealants. Produced by high-temperature continuous polymerization, it provides a high-solids, solvent-free route to a weather-resistant sealant plasticizer. Its alkoxysilyl group co-crosslinks with the modified silicone base resin during moisture curing, helping retain the plasticizer in the cured network and reduce extractable low-molecular-weight components. This makes the US Series a candidate for non-migrating plasticizer design, bleed-resistant sealant additives, stain-resistant sealant plasticizers, and long-life building sealants.
Solvent‑based acrylic pressure‑sensitive adhesive designed for fabric bonding and seamless garment construction.
ARONTACK MPT-500 is a solvent-type acrylic pressure-sensitive adhesive for fabric materials, developed as a seamless garment adhesive, textile bonding adhesive, and no-sew fabric adhesive for thermocompression bonding. It can be coated as a fabric pressure-sensitive adhesive or supplied as MF-500 fabric adhesive film; MF-500NTD offers reduced surface tack. Used between fabric layers and bonded by hot press at 130–150°C, the material supports fabric bonding tape, hem bonding, bonded seams, garment seam adhesive tape, and textile lamination for underwear and winter clothing. Seamless construction can reduce skin irritation from sewn seams and improve wind resistance and heat retention.
Fuel cell stack adhesive
ARONIX UVX and ARON MELT are fuel cell adhesives adopted in Toyota’s second-generation MIRAI. They meet fuel cell stack adhesive requirements for seconds-scale bonding, mass production, hydrolysis resistance, durability, and quality stability. In a stack of hundreds of cells, they support fuel cell bonding and sealing of hydrogen, air, and cooling-water flow channels. ・ARONIX UVX is a solvent-free, acrylate-based UV-curable fuel cell adhesive for fuel cell membrane bonding. ・ARONIX UVX is a solvent-free, acrylate-based UV-curable fuel cell adhesive for fuel cell membrane bonding.
A plastic optical window and glass alternative for automotive LiDAR
ARONIX Sheet NIR Series is an infrared-transmitting optical sheet for LiDAR covers, IR/NIR sensor covers, and near-infrared filters. By integrating a LiDAR sensor cover with a visible-light-cut NIR pass filter, it reduces parts count and supports LiDAR miniaturization and weight reduction. As a plastic optical window and glass alternative for automotive LiDAR, it combines high infrared transmittance with visible-light blocking to suppress sensor noise.
As additives
IXE and IXEPLAS are heat-resistant inorganic ion exchangers developed as ion scavengers for electronic materials and ion-trapping additives for semiconductor package encapsulants. Their low-impurity formulations are free of RoHS-restricted substances, selectively capture ionic impurities such as chloride ion (Cl−) and sodium ion (Na+), and retain captured ions with little release. As an inorganic ion exchanger for resin, epoxy encapsulants, and FPC adhesive layers, they are designed to improve electronic material reliability by reducing ionic contamination that can promote corrosion, electrochemical migration, open circuits, or short circuits.
As additives
IXE®-700H is a novel Mg/Al-based inorganic ion catcher developed as an ion-catching agent and inorganic ion scavenger for semiconductor packaging. As electronic devices move toward miniaturization, higher performance, high-density packages and narrow wiring pitch, ionic contamination—especially chloride ions in epoxy resin and epoxy encapsulants—can promote copper electrochemical migration, short circuits and package failure. IXE-700H is a semiconductor package reliability additive designed to suppress ion contamination, prevent ion-related failure in epoxy, and improve the moisture-resistance reliability and humidity reliability of encapsulants.
The heat-resistant deodorant powder can be dispersed with a binder to form a deodorant coating for nonwoven fabric or compounded as a resin-kneading deodorant and deodorant masterbatch additive.
KESMON NS-60 is a multi-odor gas adsorbent based on a metal organic framework (MOF), developed as a MOF deodorant, MOF gas adsorbent, and deodorant additive for complex odors. Its porous structure provides a specific surface area of 800–1,100 m²/g. This white powder has an average particle diameter of about 20 μm, water resistance, and heat resistance up to 350°C, supporting use in fibers, nonwoven fabric, resin, polypropylene, and polyester without compromising appearance.
Anti-allergen filter coatings for air purifiers; anti-allergen car-interior treatments for car seats and mats; anti-allergen bedding additives for sheets, pillows, and comforter filling; anti-allergen mask materials; and treatments for carpets, clothing, wallpaper, and flooring materials.
AlleRemove™ ZTP-170 is an organic–inorganic composite allergen reduction agent for anti-allergen treatment of textiles, filters, and interior materials. As an anti-allergen additive and textile-finishing anti-allergen agent, it combines an inorganic base with a polyphenol-based organic component and interacts with allergen proteins through two inactivation mechanisms. ELISA testing showed more than 99% inactivation of the house-dust mite allergen Der f II (Der f 2) and cedar pollen allergen Cry j 1 using ZTP-170 powder. Cotton/acrylic fabric coated at 2 g/m² with an acrylic binder achieved more than 99% inactivation for both, supporting dust mite allergen reduction and cedar pollen allergen reduction in coated products.
NOVARON can be used as an antimicrobial additive for plastics, antibacterial additive for fibers, antibacterial coating additive, antibacterial additive for films, antibacterial textile treatment, antimicrobial masterbatch additive, and antibacterial paint additive.
NOVARON is a silver-based inorganic antimicrobial agent based on hexagonal zirconium phosphate, an inorganic ion exchanger loaded with silver ions. This fine-particle antibacterial additive combines high heat resistance, low water content, low silver-ion elution, and discoloration resistance, supporting use in plastics, fibers, films, coatings, paints, and ceramics. Grades include powders for fibers, films, transparent resins, molded plastics, and PVC, plus antimicrobial masterbatch grades for polyethylene and polypropylene.
Antiviral treatment for masks and clothing, bedding, carpets and mats, car seats and car mats, air-purifier filters, wall and floor coverings, plastic bags and gloves, LCD protective films, and remote-control covers.
NOVARON® IV is an inorganic antiviral processing agent and antiviral additive for textiles, fabrics, filters, and interior materials. The lineup includes NOVARON IV1000 for enveloped viruses, IV2000 for non-enveloped viruses, and IV3000 for both virus types, supporting evaluation as an antiviral textile treatment, antiviral fabric finish, antiviral coating for fabric, or antiviral agent for nonwoven fabric. IV1000 is a white, fine-particle inorganic powder with an average particle diameter of about 1 μm, heat resistance up to 600°C, moisture content below 1 wt%, and insolubility in water and solvents. These properties support heat-resistant, water-resistant, low-discoloration processing for varied materials and shapes.
Resin kneading offers durable, low-cost processing compared with surface coating, making IV4000 a candidate for antiviral plastics in household goods, home appliances, interior and building materials, and surfaces such as handles and switches. Performance and compatibility should be confirmed for each resin, molding process, and finished product.
NOVARON® IV4000 is a silver-free inorganic antiviral processing agent for resins, developed as an antiviral additive for plastics and an antiviral agent for resin compounding. Unlike conventional silver-based materials, which may require higher loading and discolor after light exposure, this white powder provides high antiviral activity in plastic at low dose. With a particle size of approx. 10 μm, heat resistance of at least 300°C, moisture content below 1 wt%, and bulk density of approx. 0.8 g/cm³, it is easy to handle and incorporate into molded products.